Yadda za a zabi HASL, ENIG, OSP tsarin da'ira surface jiyya?

Bayan mun zayyana daPCB allon, Muna buƙatar zaɓar tsarin kulawa na farfajiya na allon kewayawa.Hanyoyin da aka saba amfani da su na kula da da'ira sune HASL (tsarin fesa tin surface), ENIG (tsarin zinari na nutsewa), OSP (tsarin maganin iskar shaka), da saman da aka saba amfani da shi Ta yaya za mu zabi tsarin jiyya?Daban-daban matakan jiyya na PCB suna da caji daban-daban, kuma sakamakon ƙarshe ma ya bambanta.Kuna iya zaɓar bisa ga ainihin halin da ake ciki.Bari in gaya muku game da fa'idodi da rashin amfani da hanyoyin jiyya daban-daban guda uku: HASL, ENIG, da OSP.

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1. HASL (Tsarin fesa tin saman)

An raba aikin fesa gwangwani zuwa gwangwanin fesa dalma da fesa dalma mara dalma.Tsarin fesa tin shine mafi mahimmancin tsarin jiyya a saman a cikin 1980s.Amma yanzu, ƙananan allon da'ira sun zaɓi tsarin fesa tin.Dalilin shi ne cewa allon kewayawa a cikin "kananan amma mai kyau" shugabanci.Tsarin HASL zai haifar da ƙwallayen solder mara kyau, ɓangaren tin na ball wanda ya haifar lokacin walda mai kyauAyyukan Majalisar PCBshuka don neman mafi girma matsayi da fasaha don samar da ingancin, ENIG da SOP saman jiyya tafiyar matakai ana zabar sau da yawa.

Amfanin tin da aka fesa da gubar  : ƙananan farashin, kyakkyawan aikin walda, mafi kyawun ƙarfin injiniya da sheki fiye da tin da aka fesa gubar.

Lalacewar tin da aka fesa dalma: Tin da aka fesa gubar ya ƙunshi ƙarfe mai nauyi na gubar, wanda ba shi da alaƙa da muhalli wajen samarwa kuma ba zai iya wuce ƙimar kare muhalli kamar ROHS ba.

Amfanin fesa tin mara gubar: ƙananan farashi, kyakkyawan aikin walda, kuma in mun gwada da yanayin muhalli, na iya wuce ROHS da sauran ƙimar kariyar muhalli.

Rashin lahani na fesa tin mara gubar: Ƙarfin injina da sheki ba su da kyau kamar fesa tin mara gubar.

Haɓaka gama gari na HASL: Saboda shimfidar saman allon da aka fesa tin ba shi da kyau, bai dace da siyar da fil ɗin da ke da rata mai kyau da abubuwan da suka yi ƙanƙanta ba.Ana iya samar da ƙwanƙwasa cikin sauƙi a cikin sarrafa PCBA, wanda zai iya haifar da gajeriyar da'irori zuwa abubuwan haɗin gwiwa tare da tazara mai kyau.

 

2. ENIG(Tsarin nitsewar zinari)

Tsarin nutsewar zinari tsari ne na ci-gaba na jiyya na sama, wanda galibi ana amfani dashi akan allunan da'ira tare da buƙatun haɗin aiki da tsawon lokacin ajiya akan saman.

Abubuwan da aka bayar na ENIG: Ba shi da sauƙi don oxidize, ana iya adana shi na dogon lokaci, kuma yana da shimfidar wuri.Ya dace da siyar da filaye masu tazara mai kyau da kuma abubuwan haɗin gwiwa tare da ƙananan haɗin gwiwa.Za'a iya maimaita sake kwarara sau da yawa ba tare da rage karfin sa ba.Ana iya amfani da shi azaman maƙalli don haɗin waya na COB.

Lalacewar ENIG: Babban farashi, ƙarancin walda mai ƙarfi.Domin ana amfani da tsarin nickel plating mara amfani, yana da sauƙi a sami matsalar faifan diski.Layer na nickel oxidizes akan lokaci, kuma dogaro na dogon lokaci shine batun.

PCBFuture.com3. OSP (tsarin anti-oxidation)

OSP wani fim ne na halitta wanda aka samar da sinadarai a saman jan ƙarfe mara ƙarfi.Wannan fim yana da anti-oxidation, zafi da juriya na danshi, kuma ana amfani dashi don kare saman jan karfe daga tsatsa (oxidation ko vulcanization, da dai sauransu) a cikin yanayi na al'ada, wanda yake daidai da maganin anti-oxidation.Koyaya, a cikin siyar da babban zafin jiki na gaba, fim ɗin mai kariya dole ne a cire shi cikin sauƙi ta hanyar juzu'in, kuma za'a iya haɗa saman tagulla mai tsabta da aka fallasa nan da nan tare da narkakkar solder don samar da haɗin gwiwa mai ƙarfi a cikin ɗan gajeren lokaci.A halin yanzu, adadin allunan da'ira ta amfani da tsarin jiyya na saman OSP ya karu sosai, saboda wannan tsari ya dace da ƙananan allunan kewayawa da manyan allunan da'irar fasaha.Idan babu buƙatun aikin haɗin saman ƙasa ko iyakance lokacin ajiya, tsarin OSP zai zama mafi kyawun tsarin jiyya na saman.

Amfanin OSP:Yana da duk fa'idodin walda tagulla mara amfani.Hakanan za'a iya sake farfado da allon da ya ƙare (watanni uku), amma yawanci yana iyakance ga lokaci ɗaya.

Lalacewar OSP:OSP yana da sauƙi ga acid da zafi.Lokacin da aka yi amfani da shi don siyarwar sake kwarara na biyu, yana buƙatar kammala shi cikin wani ɗan lokaci.Yawancin lokaci, tasirin sake kwarara na biyu zai zama mara kyau.Idan lokacin ajiyar ya wuce watanni uku, dole ne a sake farfado da shi.Yi amfani a cikin sa'o'i 24 bayan buɗe kunshin.OSP Layer ne mai rufewa, don haka dole ne a buga wurin gwajin tare da manna mai siyarwa don cire ainihin Layer OSP don tuntuɓar maɓallin fil don gwajin lantarki.Tsarin taro yana buƙatar manyan canje-canje, bincika ɗanyen saman jan ƙarfe yana da illa ga ICT, binciken ICT da ya wuce kima zai iya lalata PCB, yana buƙatar kariyar hannu, iyakance gwajin ICT da rage maimaita gwaji.

https://www.pcbearth.com/turnkey-pcb-assembly.html

Abin da ke sama shine nazarin tsarin jiyya na saman HASL, ENIG da allon kewayawa OSP.Kuna iya zaɓar tsarin jiyya na saman don amfani bisa ga ainihin amfani da allon kewayawa.

Idan kuna da wasu tambayoyi, da fatan za a ziyarciwww.PCBFuture.comdon ƙarin sani.


Lokacin aikawa: Janairu-31-2022